ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,117, issued on Oct. 7, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).
"Die bonding systems, and methods of using the same" was invented by Andreas Marte (Berg, Switzerland), Daniel Buergi (Berg, Switzerland), Urban Ernst (Berg, Switzerland), Eirini Kakkava (Zurich), Alexander Holzer (Zurich), Mathias Moser (Zurich) and Fabian Schneider (Zurich).
According to the abstract* released by the U.S. Patent & Trademark Office: "A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding...