ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,109, issued on March 18, was assigned to Kulicke and Soffa Industries inc. (Fort Washington, Pa.).

"Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine" was invented by Gary S. Gillotti (North Wales, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of determining a bonding status between wire and at least one bonding location of a semiconductor device is provided. The method includes the steps of: (a) bonding a portion of wire to at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine; and (b) detecting whether another portion of wire engaged ...