ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,175, issued on Aug. 5, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).
"Bonding systems, and methods of providing a reducing gas on a bonding system" was invented by Adeel Ahmad Bajwa (Blue Bell, Pa.), Thomas J. Colosimo Jr. (West Chester, Pa.) and Matthew B. Wasserman (Radnor, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding sys...