US Patent Issued to Korea Institute of Science and Technology on May 27 for "Stretchable substrate having improved stretching deformation uniformity through control of spatial crosslinking degree and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,644, issued on May 27, was assigned to Korea Institute of Science and Technology (Seoul, South Korea).

"Stretchable substrate having improved stretching deformation uniformity through control of spatial crosslinking degree and method of manufacturing the same" was invented by Seungjun Chung (Seoul, South Korea), Jun Chan Choi (Seoul, South Korea), Hoon Yeub Jeong (Seoul, South Korea), Jeong Gon Son (Seoul, South Korea), Heesuk Kim (Seoul, South Korea) and Phillip Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of manufacturing a stretchable substrate having improved stretching deformation uniformity throug...