US Patent Issued to Korea Institute of Science and Technology on March 18 for "Stretchable substrate having improved thickness deformation uniformity through control of spatial crosslinking degree and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,914, issued on March 18, was assigned to Korea Institute of Science and Technology (Seoul, South Korea).

"Stretchable substrate having improved thickness deformation uniformity through control of spatial crosslinking degree and method of manufacturing the same" was invented by Seungjun Chung (Seoul, South Korea), Jun Chan Choi (Seoul, South Korea), Hoon Yeub Jeong (Seoul, South Korea), Phillip Lee (Seoul, South Korea), Jeong Gon Son (Seoul, South Korea) and Heesuk Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of manufacturing a stretchable substrate having improved thickness deformation uniformity throu...