US Patent Issued to KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY on July 15 for "Epoxy resin, preparing method thereof, epoxy composition comprising the same, and use thereof" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,057, issued on July 15, was assigned to KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (Chungcheongnam-do, South Korea).

"Epoxy resin, preparing method thereof, epoxy composition comprising the same, and use thereof" was invented by Hyun Aee Chun (Suwon-si, South Korea), Sook Yeon Park (Gunpo-si, South Korea), Yun Ju Kim (Seoul, South Korea) and Su Jin Park (Osan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000...