US Patent Issued to Korea Electronics Technology Institute on Nov. 11 for "Waveguide package, method of manufacturing the same, and package housing" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,944, issued on Nov. 11, was assigned to Korea Electronics Technology Institute (Seongnam-si, South Korea).

"Waveguide package, method of manufacturing the same, and package housing" was invented by Jong Min Yook (Seongnam-si, South Korea), Je In Yu (Seoul, South Korea) and Dong Su Kim (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A waveguide package and a method for manufacturing the same are disclosed. The waveguide package includes a package structure including a waveguide opened toward one side surface of a substrate, a semiconductor chip mounted on one surface of the package structure and configured to output an electr...