US Patent Issued to Korea Electronics Technology Institute on July 8 for "3D printing slicing method for solving quantization error problem" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,350,886, issued on July 8, was assigned to Korea Electronics Technology Institute (Seongnam-si, South Korea).

"3D printing slicing method for solving quantization error problem" was invented by Hwa Seon Shin (Yongin-si, South Korea), Hye In Lee (Anyang-si, South Korea), Sung Hwan Chun (Seoul, South Korea), Sung Hun Park (Seoul, South Korea) and Ji Min Jang (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a 3D printing slicing method for solving a quantization error problem. A 3D model slicing method according to an embodiment of the present invention comprises: receiving, as input, data of a 3D model to be three-dimensionall...