US Patent Issued to Korea Electronics Technology Institute on Feb. 25 for "Method for creating 2D slicing polyline based support structure for 3D printing" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,233,601, issued on Feb. 25, was assigned to Korea Electronics Technology Institute (Seongnam-si, South Korea).

"Method for creating 2D slicing polyline based support structure for 3D printing" was invented by Hwa Seon Shin (Yongin-si, South Korea), Hye In Lee (Anyang-si, South Korea), Sung Hwan Chun (Seoul, South Korea) and Sung Hun Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for creating a 2D slicing polyline based support structure for 3D printing. A method for creating a support structure according to an embodiment of die present invention comprises: slicing a 3D model into a plurality of 2D layers; co...