US Patent Issued to Korea Electronics Technology Institute on Aug. 26 for "Method for modifying design on basis of additive cross-section outline for 3D printing" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,412, issued on Aug. 26, was assigned to Korea Electronics Technology Institute (Seongnam-si, South Korea).

"Method for modifying design on basis of additive cross-section outline for 3D printing" was invented by Hye In Lee (Anyang-si, South Korea), Hwa Seon Shin (Yongin-si, South Korea), Sung Hwan Chun (Seoul, South Korea) and Sung Hun Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for modifying a design on the basis of an additive cross-section outline for 3D printing of an additive manufacturing method. The method for modifying a design on the basis of an additive cross-section outline according to an ...