ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,556, issued on Nov. 25, was assigned to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Daejeon, South Korea).

"Composite material capable of measuring bending deformation, spring including the same, and manufacturing method thereof" was invented by Seong Su Kim (Daejeon, South Korea), Hyunsoo Hong (Daejeon, South Korea), Muhammad Salman Sarfraz (Daejeon, South Korea), Seung Yoon On (Daejeon, South Korea) and Jaemoon Jeong (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a composite material capable of measuring bending deformation, the composite material including: a first conductive composite body that is bendab...