US Patent Issued to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY on Jan. 20 for "Heat dissipating device" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,434, issued on Jan. 20, was assigned to KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (Daejeon, South Korea).

"Heat dissipating device" was invented by Sung Jin Kim (Daejeon, South Korea), Young Jin Lee (Daejeon, South Korea) and Juhyeon Lee (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipating device. The heat dissipating device may include: a heat dissipating part having a heat dissipating structure formed on one surface thereof, the heat dissipating structure being configured to dissipate heat received from a heat source; and a fluid distributing part disposed on the one surface of the heat dissipating part ...