US Patent Issued to KONINKLIJKE PHILIPS on Nov. 11 for "Curved circuit substrate for intraluminal ultrasound imaging assembly" (California Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,465,329, issued on Nov. 11, was assigned to KONINKLIJKE PHILIPS N.V. (Eindhoven, Netherlands).

"Curved circuit substrate for intraluminal ultrasound imaging assembly" was invented by Nathan Andrew Williams (San Diego), David Kenneth Wrolstad (Fallbrook, Calif.), Reynaldo Borja Halili (San Diego), Megan Danielle Friedlander (San Diego) and Maritess Minas (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An intraluminal ultrasound imaging device includes a flexible elongate member and an ultrasound imaging assembly coupled to a distal portion of the flexible elongate member. The ultrasound imaging assembly includes a flexible substrate comprising ...