US Patent Issued to KONINKLIJKE PHILIPS on Dec. 9 for "Heat-dissipating arrangements for medical devices and associated devices, systems, and methods" (Dutch Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,490,959, issued on Dec. 9, was assigned to KONINKLIJKE PHILIPS N.V. (Eindhoven, Netherlands).

"Heat-dissipating arrangements for medical devices and associated devices, systems, and methods" was invented by Roopesh Edavana (Eindhoven, Netherlands) and Rob Wilhelmus Van Gils (Diessen, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a device for medical imaging, such as intravascular ultrasound (IVUS) imaging. The device includes a printed circuit board and an enclosure configured to disperse heat generated by the printed circuit board. The enclosure comprises a first heat spreader coupled to and in thermal contact with the printed ...