US Patent Issued to KOMIYAMA ELECTRON on Feb. 3 for "Resin surface hydrophilization method, plasma processing device, laminate body, and laminate body manufacturing methodresin surface hydrophilization method, plasma processing device, laminate body, an laminate body manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,223, issued on Feb. 3, was assigned to KOMIYAMA ELECTRON CORP. (Yamanashi, Japan).

"Resin surface hydrophilization method, plasma processing device, laminate body, and laminate body manufacturing methodresin surface hydrophilization method, plasma processing device, laminate body, an laminate body manufacturing method" was invented by Haruo Hashiguchi (Yamanashi, Japan) and Hiroyoshi Kubo (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma processing device may include first and second processing devices. The first processing device may include a first chamber, a first exhaust pump which provides, into the first chamber, a first...