US Patent Issued to Kokusai Electric on Sept. 23 for "Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,409, issued on Sept. 23, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium" was invented by Teruo Yoshino (Toyama, Japan), Naofumi Ohashi (Toyama, Japan) and Tadashi Takasaki (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique capable of improving a uniformity of a substrate processing on a substrate surface. According to one aspect thereof, there is provided a substrate processing apparatus including: a substrate processing room; a plasma generation r...