US Patent Issued to Kokusai Electric on Oct. 7 for "Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,423, issued on Oct. 7, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium" was invented by Hiroki Hatta (Toyama, Japan), Yuji Takebayashi (Toyama, Japan), Yusaku Okajima (Toyama, Japan) and Shota Tanaka (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique capable of improving a step coverage performance of a film formed on a substrate. According to one aspect thereof, there is provided a substrate processing method including: (a1) supplying a first process ...