ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,031, issued on Nov. 4, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).
"Method of processing substrate, recording medium, and substrate processing apparatus" was invented by Atsuro Seino (Toyama, Japan), Arito Ogawa (Toyama, Japan) and Yutaka Matsuno (Toyama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) supplying a first gas containing hydrogen and oxygen to a substrate in a process chamber; (b) supplying a second gas containing nitrogen and hydrogen to the substrate; (c) supplying a third gas containing a halogen element to the substrate; (d) supplying a reaction gas to the substrate; (e) perf...