US Patent Issued to Kokusai Electric on Nov. 18 for "Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,648, issued on Nov. 18, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Hirohisa Yamazaki (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a technique capable of suppressing an adhesion of deposits to an inside of a reaction vessel of a substrate processing apparatus. According to one aspect, there is provided a substrate processing apparatus including: a substrate retainer provided with a substrate support region; a heat insulator provided b...