ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,707, issued on Nov. 11, was assigned to Kokusai Electric Corp. (Tokyo).
"Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus" was invented by Arito Ogawa (Toyama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a technique capable of suppressing the generation of particles due to a film peeling in a process chamber. According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) loading a substrate with an oxide film formed thereon into a process chamber wherein a metal-containing film i...