US Patent Issued to Kokusai Electric on March 18 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,069, issued on March 18, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Yukitomo Hirochi (Toyama, Japan), Takashi Nogami (Toyama, Japan), Norichika Yamagishi (Toyama, Japan) and Yoshihiko Yanagisawa (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of the technique, there is provided a substrate processing apparatus including: a process housing including a process chamber in which a substrate is processed; a transfer housing provided adjacent to the process housing ...