US Patent Issued to Kokusai Electric on March 18 for "Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,072, issued on March 18, was assigned to Kokusai Electric Corp. (Tokyo).

"Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device" was invented by Masato Kawanishi (Toyama, Japan), Takumi Ito (Toyama, Japan) and Kimihiko Nakatani (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) supplying a first gas containing a group XIV element to a substrate on which a film containing the group XIV element is formed such that reaction by-products generated by reaction with the group XIV element contained in the film formed on t...