US Patent Issued to Kokusai Electric on June 24 for "Substrate processing apparatus, process vessel, method of manufacturing semiconductor device and non-transitory tangible medium" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,529, issued on June 24, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, process vessel, method of manufacturing semiconductor device and non-transitory tangible medium" was invented by Shinya Morita (Toyama, Japan) and Seiyo Nakashima (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique for connecting a nozzle to a reaction tube while preventing the nozzle from collapsing includes a substrate processing apparatus including: a gas introduction structure comprising a non-metallic material penetrating a side wall of a process vessel and integrated with the side wall as a single structure, wherein a ...