US Patent Issued to Kokusai Electric on June 17 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,401, issued on June 17, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Hideto Tateno (Toyama, Japan) and Satoshi Takano (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of the present disclosure, there is provided a technique that includes: a substrate retainer; a reaction tube; a heater configured to heat an inside of the reaction tube; a gas supplier configured to supply a process gas to substrates accommodated in the reaction tube; an exhauster configured to exha...