US Patent Issued to KOKUSAI ELECTRIC on June 10 for "Wafer support of semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. D1,078,667, issued on June 10, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Wafer support of semiconductor manufacturing apparatus" was invented by Tatsuki Jinden (Toyama, Japan) and Shinya Morita (Toyama, Japan).

The patent was filed on Feb. 22, 2023, under Application No. D/885,256.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1078667&OS=D1078667&RS=D1078667

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