US Patent Issued to KOKUSAI ELECTRIC on June 10 for "Method of processing substrate, substrate processing apparatus, recording medium, and manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,720, issued on June 10, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Method of processing substrate, substrate processing apparatus, recording medium, and manufacturing semiconductor device" was invented by Toshiyuki Kikuchi (Toyama, Japan) and Naofumi Ohashi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: receiving type information corresponding to substrate processing; reading the type information and processing time information corresponding to the type information from a memory; calculating a ratio of a processing time of a predetermined process to a total time of the processing time...