US Patent Issued to Kokusai Electric on July 8 for "Substrate processing method, recording medium, and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,908, issued on July 8, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing method, recording medium, and substrate processing apparatus" was invented by Takeo Hanashima (Toyama, Japan) and Kazuhiro Harada (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) supplying a precursor gas from a precursor gas supply line into a process chamber in which the substrate is accommodated; and (b) supplying a reaction gas into the process chamber in which the substrate is accommodated,...