US Patent Issued to Kokusai Electric on July 8 for "Cleaning method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,868, issued on July 8, was assigned to Kokusai Electric Corp. (Tokyo).

"Cleaning method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus" was invented by Yuma Ikeda (Toyama, Japan), Kazuki Nonomura (Toyama, Japan) and Kenichi Suzaki (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) lowering a temperature in a process chamber supplied with a cleaning gas containing a halogen element while being heated to a first temperature, from the first temperature to a second temperature equal to or lower than a temperature at which substrate processing ...