US Patent Issued to KOKUSAI ELECTRIC on July 8 for "Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,887, issued on July 8, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Cleaning method, method of manufacturing semiconductor device, and substrate processing apparatus" was invented by Gen Li (Toyama, Japan), Hirohisa Yamazaki (Toyama, Japan), Kenichi Suzaki (Toyama, Japan) and Yuji Takebayashi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) supplying a chlorine-containing gas to an interior of a process vessel, to which an oxide film adheres, under a first pressure; (b) exhausting the interior of the process vessel; (c) supplying an oxygen-containing gas into the process vessel; (d) ex...