US Patent Issued to Kokusai Electric on July 29 for "Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,544, issued on July 29, was assigned to Kokusai Electric Corp. (Tokyo).

"Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" was invented by Shoma Miyata (Toyama, Japan), Kimihiko Nakatani (Toyama, Japan), Takayuki Waseda (Toyama, Japan), Takashi Nakagawa (Toyama, Japan) and Motomu Degai (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing technique including: (a) modifying a first base surface of a substrate by supplying a first modifier and a second modifier to the substrate having a surface on which the first base and a second base are exposed, wherein the fi...