US Patent Issued to Kokusai Electric on July 29 for "Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,788, issued on July 29, was assigned to Kokusai Electric Corp. (Tokyo).

"Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium" was invented by Kazuki Nonomura (Toyama, Japan) and Yuji Takebayashi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of the present disclosure, there is provided a technique including: (a) stacking and accommodating substrates in a process chamber; (b) supplying a source gas to the plurality of substrates through a first nozzle provided in the process chamber along a stacking direction of the plurality of subst...