US Patent Issued to Kokusai Electric on July 1 for "Substrate processing apparatus, heat insulator assembly and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,344,935, issued on July 1, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, heat insulator assembly and method of manufacturing semiconductor device" was invented by Akihiro Sato (Toyama, Japan), Shuhei Saido (Toyama, Japan) and Kenta Kasamatsu (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of a technique the present disclosure, there is provided a substrate processing apparatus including: a substrate retainer provided with a heat insulating region at a lower portion thereof; a first reaction tube with open upper and lower ends; a second reaction tube with a closed upper end and an op...