US Patent Issued to KOKUSAI ELECTRIC on Jan. 27 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,730, issued on Jan. 27, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Kazuo Nakaya (Toyama, Japan), Fumie Ando (Toyama, Japan), Susumu Nishiura (Toyama, Japan) and Hiroshi Ekko (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes a processor configured to be capable of executing a process recipe to process a substrate; and a pressure controller configured to be capable of controlling a pressure of a process chamber, in which the substrate is processed, by adjusting an opening degr...