US Patent Issued to Kokusai Electric on Jan. 20 for "Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,137, issued on Jan. 20, was assigned to Kokusai Electric Corp. (Tokyo).

"Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" was invented by Hiroki Hatta (Toyama, Japan), Takeo Hanashima (Toyama, Japan), Koei Kuribayashi (Toyama, Japan) and Shin Sone (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes forming a film on at least one substrate by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing: (a) performing a first set a number of times, the first set including non-simultaneously performing: supp...