US Patent Issued to Kokusai Electric on Feb. 4 for "Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,959, issued on Feb. 4, was assigned to Kokusai Electric Corp. (Tokyo).

"Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium" was invented by Kimihiko Nakatani (Toyama, Japan), Tsukasa Kamakura (Toyama, Japan), Hajime Karasawa (Toyama, Japan) and Kazuhiro Harada (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: forming a film on a substrate by performing, simultaneously at least for a predetermined period: supplying a first precursor to the substrate, the first precursor containing a chemical bond of a predetermined element and nitrogen or a chemica...