US Patent Issued to Kokusai Electric on Feb. 3 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,399, issued on Feb. 3, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Makoto Hirano (Toyama, Japan) and Yuji Takebayashi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the technique of the present disclosure, there is provided a substrate processing apparatus capable of improving thickness uniformity of a film formed on each substrate. The apparatus includes a substrate retainer; a reaction tube; a vertical driver for moving the substrate retainer into or out of the reaction ...