US Patent Issued to KOKUSAI ELECTRIC on Feb. 17 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,253, issued on Feb. 17, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Susumu Nishiura (Toyama, Japan), Kenichi Maeda (Toyama, Japan), Hiroyuki Kitamoto (Toyama, Japan) and Hajime Abiko (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a configuration that includes: at least one transfer mechanism configured to transfer a substrate and at least one processing mechanism configured to process the substrate; an earthquake detector configured to detect an earthquake; and a controller configured to control th...