US Patent Issued to Kokusai Electric on Feb. 10 for "Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,640, issued on Feb. 10, was assigned to Kokusai Electric Corp. (Tokyo).

"Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Tao Liu (Toyama, Japan), Kazuhiro Harada (Toyama, Japan), Tomoki Imamura (Toyama, Japan), Kazuyuki Okuda (Toyama, Japan) and Takaaki Noda (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) supplying a first gas containing a predetermined element to the substrate; (b) supplying a second gas containing carbon and nitrogen to the substrate; (c) supplying a nitrogen-containing ...