ALEXANDRIA, Va., Feb. 11 -- United States Patent no. D1,112,115, issued on Feb. 10, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).
"Insulation plate for a semiconductor manufacturing apparatus" was invented by Yusaku Okajima (Toyama, Japan).
The patent was filed on Dec. 11, 2023, under Application No. D/920,441.
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