US Patent Issued to KOKUSAI ELECTRIC on Dec. 2 for "Substrate processing apparatus and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,010, issued on Dec. 2, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus and method of manufacturing semiconductor device" was invented by Kenji Shirako (Toyama, Japan) and Tomoshi Taniyama (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a boat including plural slots to hold at least one substrate, a process furnace that processes the at least one substrate held in the boat, a boat elevator that raises and lowers the boat, a transfer device that transfers the at least one substrate between plural carriers where the at least one substrate is stored and the boat, and ...