US Patent Issued to Kokusai Electric on Dec. 2 for "Substrate processing apparatus, cleaning method, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,999, issued on Dec. 2, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, cleaning method, and method of manufacturing semiconductor device" was invented by Kenichi Suzaki (Toyama, Japan) and Yuma Ikeda (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes a reaction container configured to process a substrate; a cleaning gas supply system configured to supply a cleaning gas into the reaction container; a lid configured to be capable of closing an opening of the reaction container and made of a metallic material; a protector installed over a surface of the lid at a side...