US Patent Issued to Kokusai Electric on Aug. 26 for "Substrate processing apparatus, substrate holder, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,840, issued on Aug. 26, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, substrate holder, and method of manufacturing semiconductor device" was invented by Tsuyoshi Takeda (Toyama, Japan) and Daisuke Hara (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: a process chamber that processes a plurality of substrates; a substrate holder on which the plurality of substrates is supported; an electrode that forms plasma in the process chamber, and auxiliary plate that is disposed between the plurality of substrates and assists formation of the plasma."

The patent was ...