US Patent Issued to Kokusai Electric on Aug. 26 for "Substrate processing apparatus, furnace opening assembly, substrate processing method, method of manufacturing semiconductor device and non-transitory tangible medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,460, issued on Aug. 26, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, furnace opening assembly, substrate processing method, method of manufacturing semiconductor device and non-transitory tangible medium" was invented by Tatsuya Nishino (Toyama, Japan), Akinori Tanaka (Toyama, Japan), Akira Horii (Toyama, Japan) and Tomoshi Taniyama (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique capable of reducing a corrosion of a furnace opening shutter. According to one aspect thereof, a substrate processing apparatus includes: a process vessel provided with an opening and a first se...