US Patent Issued to KOKUSAI ELECTRIC on Aug. 26 for "Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,874, issued on Aug. 26, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" was invented by Motomu Degai (Toyama, Japan), Kimihiko Nakatani (Toyama, Japan), Takashi Nakagawa (Toyama, Japan), Takayuki Waseda (Toyama, Japan) and Yoshitomo Hashimoto (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provide a technique that includes: etching a base on a surface of a substrate by performing a cycle, the cycle including: (a) forming a layer on a surface of the base by exposing the base to a modifying agent; and (b) causing a react...