ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,949, issued on Aug. 12, was assigned to Kokusai Electric Corp. (Tokyo).
"Substrate processing apparatus" was invented by Teruo Yoshino (Toyama, Japan), Naofumi Ohashi (Toyama, Japan) and Tadashi Takasaki (Toyama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a technique capable of reducing an amount of moisture in a low temperature region in a substrate processing apparatus provided with a transfer chamber. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber provided with a heater; a load lock chamber; a transfer chamber provided between the process cham...