US Patent Issued to KOKUSAI ELECTRIC on Aug. 12 for "Substrate processing apparatus, substrate holding apparatus, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,969, issued on Aug. 12, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, substrate holding apparatus, and method of manufacturing semiconductor device" was invented by Keishin Yamazaki (Toyama, Japan) and Norichika Yamagishi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes a process chamber configured to process at least one substrate; a microwave generator configured to generate a microwave; a substrate holder configured to load and hold the at least one substrate; and a rotator which includes an output shaft configured to support the substrate holder and an in...