US Patent Issued to KOKUSAI ELECTRIC on Aug. 12 for "Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,962, issued on Aug. 12, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium" was invented by Hiroshi Ashihara (Tokyo) and Yuji Takebayashi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: at least one process chamber in which at least one substrate is processed; a mounting stage configured to be capable of mounting the at least one substrate on the mounting stage; a transport chamber including a conveyor configured to be capable of holding the mounting stage at least...