US Patent Issued to Kokusai Electric on Aug. 12 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,139, issued on Aug. 12, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Daisuke Hara (Toyama, Japan), Takashi Yahata (Toyama, Japan), Kenji Shinozaki (Toyama, Japan) and Kazuhiko Yamazaki (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a first gas supply system configured to supply a first gas onto the substrate in the process chamber ...