US Patent Issued to KOKUSAI ELECTRIC on April 29 for "Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,683, issued on April 29, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Method of manufacturing semiconductor device, substrate processing method, non-transitory computer-readable recording medium and substrate processing apparatus" was invented by Yasunobu Koshi (Toyama, Japan), Kazuyuki Okuda (Toyama, Japan), Yoshitomo Hashimoto (Toyama, Japan) and Katsuyoshi Harada (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one aspect of a technique of the present disclosure, there is provided a method of manufacturing a semiconductor device, including: (A) forming a film containing a predetermined element and nitrogen on a substr...