US Patent Issued to KOKUSAI ELECTRIC on April 22 for "Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording medium" (Japanese Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,501, issued on April 22, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, method of processing substrate, and recording medium" was invented by Takayuki Ota (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object transfer device includes: a motor; a motor drive circuit; an encoder that detects a motor output shaft rotation angle; a drive system that transmits motion of the output shaft to an object; an origin sensor that detects arrival of a predetermined site of the drive system interlocked with the object at a predetermined position; a drive circuit-includ...